Rigid-flex PCB

Rigid-flex PCB

Layer: 2L
Material: 1mil PI+ 0.5 Cu
Copper foil: 1/2 oz
Board Thickness: 0.4±0.05mm
Finished: ENIG
Other: CCM Module
Layer: 2L
Material: 1mil PI+ 0.5 Cu
Copper foil: 1/2 oz
Board Thickness: 0.35±0.05mm
Finished: ENIG
Other: Carbon ink 3300Ω
Layer: 2
Material: PI+FR4
Copper foil: 1/2 OZ
Board Thickness: 0.8 mm+/-10 %
Finished: Gold Plating + ENIG
Other: Rigid-Flex
Layer: 4
Material: PI+FR4
Copper foil: 1/2 OZ
Board Thickness: 1.0mm+/-10%
Finished: ENIG
Other: Rigid-Flex
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