Capability
Rigid Board Capability
| Process Step | Items | Capability |
| Material | Request Material Tg | FR-402 (Tg 135℃) |
| FR-405 (Tg 150℃) | ||
| FR-406 (Tg 170℃) High Tg Material | ||
| FR-408 (Tg 180℃) High Tg Material | ||
| Copper foil (Inner / Outer) | Max. 6 OZ | |
| Min. 1/3 OZ | ||
| Special Material | GETEK | RG200D |
| ML200D | ||
| ROGERS | RO4003C | |
| RO4350 | ||
| Arlon | 25N | |
| 25FR | ||
| Board Dimension | Working Panel size | Max. 21" × 24" ( 530 mm × 610 mm ) |
| Finished Thickness | Max. 197mil (5.0mm) | |
| Min. 16mil (0.4mm) Mutil-layer | ||
| Inner layer | Trace / Spacing | Min. 3 / 3 mil |
| Copper Weight | Min. 1/3 OZ | |
| Max. 6 OZ | ||
| Core Thickness | Max. 80mil (2.0mm) | |
| Min. 2mil (0.05mm) | ||
| Lamination | Layer Count | Max. 16L |
| Min. 2L | ||
| Layer to Layer Registration | ± 5mil | |
| Drilling | Vias | Blind Vias |
| Buried Vias | ||
| Drill True Position | Tolerance ± 3 mil | |
| Drilling hole size | Min. 8mil (0.20mm) | |
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| Plating | Aspect Ratio | 1：8 |
| Copper Wall Thickness | ≧0.8mil | |
| Outer Layer | Trace / Spacing | Min. 3 / 3 mil |
| Finished Trace Copper Thickness | Max. 8.4mil (6 OZ) | |
| Min. 11mil | ||
| Surface Finished | HASL(Lead Free) | Max. 800μ" |
| Min. 50μ" | ||
| Immersion Gold(ENIG) | Max. 12 μ" | |
| Electrolytic Gold | Max. 50μ" | |
| Immersion Tin | Max. 40μ" | |
| Immersion Silver | Max. 25μ" | |
| OSP | OK | |
| Solder Mask | Solder Mask Thickness | Max. 1.0 mil |
| Min. 0.4 mil | ||
| Solder Mask Dam Width | Min. 3mil | |
| Solder Mask Registration | ± 2mil | |
| Routing | Routing Width | Min. 30 mil |
| V-cut Angle | Min. 30° | |
| V-cut Residual | Min. 8mil (0.20mm) | |
| Bevelling Gradient | Min. 25° | |
| Test | SMT Pitch | Min. 10mil |
| BGA Pitch | Min. 32mil | |
| Impedance Control | Tolerance ± 10% | |
| Differential Impedance Control | Tolerance ± 10% | |
Flex & Rigid-Flex Board Capability
| Process Step | Items | Capability |
| Material | PI + Ra / ED Copper | OK |
| Board Dimension | Working Panel Size | 10" × 15.8"(250 mm × 400 mm) |
| Finished Board Thickness | Flex：0.1~0.4 mm | |
| Rigid-Flex：0.6~2.4 mm | ||
| Inner Layer | Trace / Spacing | Min. 4 / 4 mil |
| Copper Weight | Max. 2 OZ | |
| Min. 1/2 OZ | ||
| FCCL Core Thickness | Max. 2mil | |
| Min. 0.5mil | ||
| Lamination | Layer Count | Flex：1L~4L |
| Rigid-Flex：Max. 6L | ||
| Drilling | Hole Size | Min. 8mil (0.2mm) |
| Plating | Aspect Ratio | 1：6 |
| Available Surface Finished | Immersion Gold(ENIG) | OK |
| Immersion Tin | OK | |
| Immersion Silver | OK | |
| OSP | OK | |
| Routing | Punch | Tolerance ± 0.1 mm |
| Routing | Tolerance ± 0.2 mm | |
| Others | Cloverlayer Paste | Tolerance ± 8 mil (0.2mm) |
| Adhesive Paste | Tolerance ± 12 mil (0.3mm) | |
| Resinforce Paste | Tolerance ± 12 mil (0.3mm) |
SMT Capability
| 使用機台 | smt semi-automatic printing machine |
| Stencil Size Range | L750*W550mm |
| Min. IC Pitch | 0.3mm |
| Max. PCB Size for YAMAHA | L460*W335 |
| Min. PCB Thickness | 0.1mm |
| Min. Chip Size | 0603mm/0201inch |
| Max. BGA Size for | 31mm |
| BGA Ball Pitch | 0.4mm |
| BGA Ball Diameter | 0.22mm |
| QFP Lead Pitch | 0.3mm |
| 上件誤差 | ±0.05mm |
| Frequency of Stencil Cleaning | 每印刷15次則需清潔鋼板一次（0.4mm以內則為5-10次） |
